Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series) Book + PRICE WATCH * Amazon pricing is not included in price watch

Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series) Book

New, ship fast, delivered in 5-7 days in UK, No PO BOX.Read More

from£N/A | RRP: £58.00
* Excludes Voucher Code Discount Also available Used from £N/A
  • Foyles

    Focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity,...

As an Amazon Associate we earn from qualifying purchases. If you click through any of the links below and make a purchase we may earn a small commission (at no extra cost to you). Click here to learn more.

Would you like your name to appear with the review?

We will post your book review within a day or so as long as it meets our guidelines and terms and conditions. All reviews submitted become the licensed property of www.find-book.co.uk as written in our terms and conditions. None of your personal details will be passed on to any other third party.

All form fields are required.