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Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series) Book
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Foyles
Focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity,...
- 1606501879
- 9781606501870
- Thomas M. Moore, Robert McKenna, Richard C Brundle, Charles A. Evans
- 28 April 2010
- Momentum Press
- Hardcover (Book)
- 274
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