Area Array Packaging Handbook: Manufacturing and Assembly (Electronic Packaging and Interconnection) Book + PRICE WATCH * Amazon pricing is not included in price watch

Area Array Packaging Handbook: Manufacturing and Assembly (Electronic Packaging and Interconnection) Book

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)Read More

from£42.20 | RRP: £75.99
* Excludes Voucher Code Discount Also available Used from £68.74
  • 0071374930
  • 9780071374934
  • Ken Gilleo
  • 1 December 2001
  • McGraw-Hill Professional
  • Hardcover (Book)
  • 1000
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